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DISCRETE SEMICONDUCTORS
DATA SHEET
PEMD4; PUMD4 NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
Product data sheet Supersedes data of 2002 Jan 14 2003 Oct 10
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
FEATURES * Built-in bias resistors * Simplified circuit design * Reduction of component count * Reduced pick and place costs. APPLICATIONS * Low current peripheral driver * Replacement for general purpose transistors in digital applications * Control of IC inputs. QUICK REFERENCE DATA SYMBOL VCEO IO TR1 TR2 R1 R2
PEMD4; PUMD4
PARAMETER collector-emitter voltage output current (DC) NPN PNP bias resistor open
TYP. - - - - 10 -
MAX. 50 100 - - - -
UNIT V mA - - k -
DESCRIPTION NPN/PNP resistor-equipped transistors (see "Simplified outline, symbol and pinning" for package details).
PRODUCT OVERVIEW TYPE NUMBER PEMD4 PUMD4 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. SIMPLIFIED OUTLINE, SYMBOL AND PINNING PINNING TYPE NUMBER PEMD4 PUMD4 SIMPLIFIED OUTLINE AND SYMBOL PIN
handbook, halfpage
PACKAGE MARKING CODE PHILIPS SOT666 SOT363 SC-88 EIAJ 23 D*4
PNP/PNP COMPLEMENT PEMB4 PUMB4
NPN/NPN COMPLEMENT PEMH4 PUMH4
DESCRIPTION emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1
6 5 4
5
4
1 2 3
6
R1 TR1 R1 1 Top view 2 3 1 2 3
MDB814
TR2
4 5 6
2003 Oct 10
2
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PEMD4 PUMD4 - - DESCRIPTION plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads
PEMD4; PUMD4
VERSION SOT666 SOT363
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS - - - - - Tamb 25 C note 1 notes 1 and 2 - - -65 - -65 Tamb 25 C note 1 notes 1 and 2 - - 300 300 mW mW 200 200 +150 150 +150 mW mW C C C MIN. MAX. UNIT
Per transistor; for the PNP transistor with negative polarity VCBO VCEO VEBO IO ICM Ptot collector-base voltage collector-emitter voltage emitter-base voltage output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666 Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. storage temperature junction temperature operating ambient temperature open emitter open base open collector 50 50 5 100 100 V V V mA mA
2003 Oct 10
3
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
THERMAL CHARACTERISTICS SYMBOL Per transistor Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Per device Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Notes Tamb 25 C note 1 notes 1 and 2 Tamb 25 C note 1 notes 1 and 2 PARAMETER CONDITIONS
PEMD4; PUMD4
VALUE
UNIT
625 625
K/W K/W
416 416
K/W K/W
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - - 200 - 7 IE = ie = 0; VCB = 10 V; f = 1 MHz - - - - 2.5 3 pF pF TYP. - - - - - - 10 MAX. UNIT
Per transistor; for the PNP transistor with negative polarity ICBO ICEO IEBO hFE VCEsat R1 Cc collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain input resistor collector capacitance TR1 (NPN) TR2 (PNP) VCB = 50 V; IE = 0 VCE = 30 V; IB = 0 VCE = 30 V; IB = 0; Tj = 150 C VEB = 5 V; IC = 0 VCE = 5 V; IC = 1 mA 100 1 50 100 - 150 13 mV k nA A A nA
collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA
2003 Oct 10
4
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
PACKAGE OUTLINES
PEMD4; PUMD4
Plastic surface mounted package; 6 leads
SOT666
D
A
E
X
S
YS HE
6
5
4
pin 1 index A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT666
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 01-01-04 01-08-27
2003 Oct 10
5
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
PEMD4; PUMD4
Plastic surface mounted package; 6 leads
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2003 Oct 10
6
NXP Semiconductors
Product data sheet
NPN/PNP resistor-equipped transistors; R1 = 10 k, R2 = open
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION
PEMD4; PUMD4
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
2003 Oct 10
7
NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R75/02/pp8 Date of release: 2003 Oct 10 Document order number: 9397 750 11826

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